Technologies

1. Photon-Counting Technique
CT-Reconstruction
2. CT-Reconstruction
CT-Reconstruction
3. AI / Machine-Learning

1. Photon Counting Technology

For High-Speed X-Ray applications we use photon counting detectors in our X-Ray systems. The key component in such detectors is the conversion material CdTe, which converts the X-rays into electrical signals, and a CMOS (ASIC) which transforms the electric signals into a data stream generated by the number of photons which has entered each pixel.

The higher efficiency of the CdTe converter material (versus traditional scintillators of charge integration techniques) provides higher sensitivities with almost zero dark current noise-levels. Due to the digital photon-counting technique on the sensor chip – image acquisition times of less than 1ms can be processed. Which results in frame rates (fps) > 1000 for real-time image sequences (i.ex. crash-tests) and CT-applications up to 500fps for CT-projection image acquisitioning.

The digital photon counting principle provides also the capability to setup multiple energy-thresholds in real-time, which can be very efficient used i.ex. for material separation. (Standard-Setup: Dual-Energy Mode)

Combined inspections-modes are available for dedicated application:

  1. TDI-Line scanning (Line-Scanner)
  2. Area/Frame-Mode (Flatpanel)
  3. Frame-Scan mode (Combination of both techniques)
Photon-counting inspection modes

2. CT-Reconstruction Techniques

Available Scanning Methods Stop for Grab/On-The Fly
Reconstruction Methods FDK / SRM / Spiral-CT (new)
Automatic Geometrical Correction via reference-object (CMP)
via phantom based correction (new)
Scattering-Correction via beam-stop array
Beam-hardening correction
Ring-Artefact Reduction via mathematical correction during reco
via detector gray-level calibration
Field of View Extension measurement range extension
Partial CT via Truncate correction
CT-Volume optimization Application specific Filter Algorithm Library
Battery testing
Material analysis

3. AI / Machine-Learning Techniques

In combination with our inspection algorithm library we released now for dedicated applications also Deep-Learning Techniques based on Convolutional Neural Network.

To generate the trainings-models and prediction test-results we use a custom readaption of the TensorFlow UNet architecture.

3.1 Key-Elements of the X2-Tech Deep-Learning Workflow

Raw image and binary labelling result image
Semi-automatic labelling procedure to feed the trainings pool / Raw image and binary labelling result image)
original image versus predicted result-image
Image result display original image versus predicted result-image

3.2 Currently available Machine-Learning SW-Modules for the following applications

Void-Inspection for multi-layer components

two-layer void inspection of power hybrid’s
Two-layer void inspection of power hybrid’s (Raw images versus predicted Image after ML- Test-Run) / red-layer1, green: layer2

Anode/Cathode distance measurements for stacked batteries

Stacked-Battery Test-Result
Stacked-Battery ML Test-Result for anode-cathode distance tracing. (prediction based on stacked battery trainings-model)

Anode-length measurements for stacked batteries

Machine-Learning Technique for detecting Anode-Length

Stacked-Battery Test-Result
Stacked-Battery ML Test-Result for anode-length tracing. (prediction based on stacked battery trainings-model)

Prediction Test-Result for Anode-Length measurement (in pixel-numbers)

Stacked-Battery ML Test-Result for anode-length tracing
Stacked-Battery ML Test-Result for anode-length tracing. (prediction based on stacked battery trainings-model)